Solder balls or fines are an indication of improper process control (inadequate preheat), and/or the use of outdated solder/flux.
UNACCEPTABLE
SOLDER IN STRESS RELIEF BEND
Solder shall not extend into the stress relief bend or any leaded part. In this example, the solder is also in contact with the part body and the body seal.
NASA-STD-8739.2 [12.8.2.b.16]
UNACCEPTABLE
SOLDER PEAKS, ICICLES, SHARP EDGES
Solder peaks, icicles and/or sharp edges are an indicator of an improper process parameter and are a reliability and short-circuit concern.
NASA-STD-8739.2 [12.8.2.c.4]
Want more information on What is surface mount technology (SMT)?, Quick Supply of Scarce Components? Click the link below to contact us.